Novatel Wireless
Novatel Wireless today introduces the Expedite E162 and the Expedite E172 modules based on LGA (Land Grid Array), extending its innovative embedded mobile broadband portfolio with the ultra-thin LGA form factor targeted at tablets, mobile Internet devices, portable entertainment devices and consumer electronics devices.
The Expedite E162 provides multimode support for LTE, EV-DO Rev. A, HSPA+ and backward compatibility to existing 2G and 3G GSM and CDMA networks. The Expedite E172 provides support for LTE and backward compatibility to dual carrier HSPA+, UMTS, EDGE and GPRS air interfaces.
Samples of the new Expedite series of LGA modules for LTE networks are currently available.
“With the growing market demand for mobile connectivity in new consumer electronic devices, we have designed this new ultra-thin LGA form factor for LTE to suit the needs of our OEM partners,” says Rob Hadley, CMO of Novatel Wireless. “We’re seeing strong interest from the entire eco-system for embedded LTE solutions and we’re excited to expand our next-generation embedded module portfolio to include the popular LGA form factor.”
The LGA surface-mount technology enables device manufacturers to deliver 4G connectivity with the new LGA Expedite series, with greater efficiency, flexibility and scalability. Developing on the proven performance of the Expedite product line, Novatel Wireless ‘Expedite Series of LTE embedded LGA modules are optimized for size, thermal performance and high volume manufacturing. With the LGA form factor, the Expedite E162 and Expedite E172 are well suited for small and thin devices such as tablets and entertainment devices due to their compact size, thermal dissipation characteristics and advanced power management technology.
The new Expedite series of LGA modules further expand service possibilities for target devices by providing enhanced GPS/GNAA capabilities, allowing users to retrieve position data for navigation and location-based applications. Additional key features include Novatel Wireless’ proven Connection Manager — Mobilink 3 – supporting Windows 7, Vista and XP as well as software support for OEM tablet and notebook integration with both Windows drivers and Android RIL (from Froyo to Honeycomb).A rich set of software APIs and hardware development kits are also available to OEMs.
Novatel Wireless’ suite of embedded modules provides innovative solutions to integrate high-speed data connectivity into notebooks, netbooks, tablets and other portable entertainment devices. As the leading provider of mobile broadband solutions, Novatel Wireless has longstanding tier-one carrier and OEM relationships offering leading design, integration and certification expertise to serve its partners’ connectivity needs.
Commercial availability is expected in the second half of 2011.
